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▶Placement Speed : 11,000 CPH (Optimum)
▶The Number of Spindles : 1 Gantry x 3 Spindle
▶Component Range : 0402~□ 55mm/ ~L74 mm x W55mm (H15mm)
▶Placement Accuracy : ±40 μm @ Cpk ≥ 1.0/Chip
±30 μm @ Cpk ≥ 1.0/Lead,BGA
▶PCB Size : ~L510 x W580, Single lane
~L750 x W580(Max Option)
~L510 x W310, Dual lane
~L750 x W310(Max Option)
▶灵活的PCB处理能力
▶使用Outbuffer
▶使用PBI(Post Bonding Inspection)功能检查元器件的贴装不良
▶Height Sensor
▶Backlight识别
▶NPE(New Part editor)
▶Panorama View
▶提高了外围设备的使用便利性
